Packaging 1 ea in rigid mailer Physical form cubic (a = 6.095Å) Physical properties Thermal expansion: 6.1 x 10-6/oK; Thermal conductivity: 270 mW/cm.k at 300K; Mobility 600~800 cm2/V · sec Undoped, P-type semiconductor, growth technique: LEC, carrier concentration = 1-2 × 10-17 cm-3, EPD <103 cm-2 |